← LeaderboardsInvestigatorsiAttributed = a PI's even-split share of each grant — a $1M grant with 2 PIs counts $500K each.
International Technology Center
$5,031,060
Total funding
3
Grants
Funding over time
peak $3.4M · FY2008–10$5M$3.8M$2.5M$1.3M$0
'08
'09
'10
Funding mix
By agency
DOD$5,031,060 · 3
By mechanism
—$5,031,060 · 3
Investigators at International Technology Center
InvestigatorsiAttributed = a PI's even-split share of each grant — a $1M grant with 2 PIs counts $500K each.
Exposure= the full size of every grant they're on ($1M each).
Rising Stars
First grant in the last 5 yrs
Not enough data
Emerging Leaders
6–10 yrs in
Not enough data
All-Time
Most funded here, all years
Not enough data
Largest grants
THE HIGH-DENSITY THREE-DIMENSIONAL PACKAGING TECHNOLOGY FOR RF DEVICES PROGRAM ENTAILS THE DEVELOPMENT OF PROCESSES FOR CREATING A 3 CHIP INTEGRATED$3,373,060
· FY2008 · Department of the Air Force
TERAHERTZ SENSING AND IMAGING TECHNOLOGY$1,360,000
· FY2010 · Department of the Army
"ELECTROHYDRODYNAMIC PROPULSION CAPABILITIES ASSESSMENT$298,000
· FY2010 · Defense Advanced Research Projects Agency