THE HIGH-DENSITY THREE-DIMENSIONAL PACKAGING TECHNOLOGY FOR RF DEVICES PROGRAM ENTAILS THE DEVELOPMENT OF PROCESSES FOR CREATING A 3 CHIP INTEGRATED

$3,373,060FY2008Department of the Air ForceDOD

International Technology Center

Investigators

THE HIGH-DENSITY THREE-DIMENSIONAL PACKAGING TECHNOLOGY FOR RF DEVICES PROGRAM ENTAILS THE DEVELOPMENT OF PROCESSES FOR CREATING A 3 CHIP INTEGRATED · GrantIndex