← LeaderboardsInvestigatorsiAttributed = a PI's even-split share of each grant — a $1M grant with 2 PIs counts $500K each.
Faraday Technology, Inc
Englewood, OH
$5,515,175
Total funding
16
Grants
Funding over time
peak $1.5M · FY2005–11$2M$1.5M$1M$500K$0
'05
'06
'07
'08
'09
'10
'11
Funding mix
By agency
NSF$5,515,175 · 16
By mechanism
—$5,515,175 · 16
Investigators at Faraday Technology, Inc
InvestigatorsiAttributed = a PI's even-split share of each grant — a $1M grant with 2 PIs counts $500K each.
Exposure= the full size of every grant they're on ($1M each).
Rising Stars
First grant in the last 5 yrs
Not enough data
Emerging Leaders
6–10 yrs in
Not enough data
All-Time
Most funded here, all years
Not enough data
Largest grants
STTR Phase II: Low-Cost Manufacturing of Fuel Cell Membrane Electrode Assemblies (MEAs) with Highly Dispersed Catalyst$1,020,000
· FY2005 · TIP
SBIR Phase II: Faradayic ElectroCell$675,000
· FY2011 · TIP
SBIR Phase II: Non-Contact/Zero-Stress Surface Polishing Process for Copper/Low Dielectric Constant Semiconductors$595,791
· FY2004 · TIP
SBIR Phase II: Electroconcentration, Separation, and Rupture of Bioalgae for Fuel Production$590,000
· FY2011 · TIP
SBIR/STTR Phase II: A Low Cost Semiconductor Metallization-Planarization Process$530,042
· FY2002 · TIP
SBIR Phase II: Microfluidics Device for Real-time Process Control of Copper Plating Baths$503,294
· FY2007 · TIP
SBIR Phase II: Lead-Free Solder Process$501,925
· FY2005 · TIP
STTR Phase I: Thermally-Assisted Electro-Etching of Electronics Packages$150,000
· FY2007 · TIP
STTR Phase I: Novel Deposition Process to Produce Bilayer Alloy Electrocatalysts for PEM Fuel Cells$150,000
· FY2008 · TIP
SBIR Phase I: Electroconcentration, Separation, and Rupture of Bioalgae for Fuel Production$149,995
· FY2010 · TIP
SBIR Phase I: Faradayic ElectroCell$149,992
· FY2010 · TIP
STTR Phase I: Low-Cost Manufacturing of Fuel Cell MEAs with Highly Dispersed Catalyst$100,000
· FY2003 · TIP
SBIR Phase I: Microfluidics Device for Real-time Process Control of Copper Plating Baths$100,000
· FY2006 · TIP
SBIR Phase I: Non-Contact/Zero-Stress Surface Polishing Process for Copper/Low Dielectric Constant Semiconductors$99,991
· FY2003 · TIP
SBIR Phase I: Lead-free Solder Process$99,963
· FY2004 · TIP
SBIR Phase I: A Low Cost Semiconductor Metallization-Planarization Process$99,182
· FY2001 · TIP