← LeaderboardsInvestigatorsiAttributed = a PI's even-split share of each grant — a $1M grant with 2 PIs counts $500K each.
Cactus Materials Inc
$4,649,962
Total funding
7
Grants
Funding over time
peak $1.5M · FY2019–23$2M$1.5M$1M$500K$0
'19
'20
'21
'22
'23
Funding mix
By agency
DOE$4,649,962 · 6
NASA$0 · 1
By mechanism
—$4,649,962 · 7
Investigators at Cactus Materials Inc
InvestigatorsiAttributed = a PI's even-split share of each grant — a $1M grant with 2 PIs counts $500K each.
Exposure= the full size of every grant they're on ($1M each).
Rising Stars
First grant in the last 5 yrs
Not enough data
Emerging Leaders
6–10 yrs in
Not enough data
All-Time
Most funded here, all years
Not enough data
Largest grants
A NEW APPROACH TO ACHIEVING HIGH GRANULARITY IN LOW-GAIN AVALANCHE DETECTORS$1,349,993
· FY2020 · Department of Energy
RADIATION HARDENED DOUBLE SIDED LOW-GAIN AVALANCHE DIODE (LGAD) WITH SMALL PIXEL READOUT FOR 5D TRACKING$1,349,991
· FY2021 · Department of Energy
RADIATION HARDENED ENGINEERED SUBSTRATES FOR TIME AND SPACE RESOLUTION$1,349,979
· FY2019 · Department of Energy
NOVEL HEAVY ION FOCAL PLANE DETECTORS$200,000
· FY2022 · Department of Energy
3D INTEGRATION OF HIGH-DENSITY CMOS CIRCUITS TO HIGH RESISTIVITY SILICON DETECTOR LAYER$200,000
· FY2020 · Department of Energy
RADIATION HARDENED TRENCH-ISOLATED LOW-GAIN AVALANCHE DIODE (TILGAD).$199,999
· FY2023 · Department of Energy
THE OBJECTIVE OF THIS WORK IS TO DEVELOP MILLIMETER WAVE ARRAYS WITH ULTRA-HIGH ACCURACY ALIGNMENT (<300NM) USING HYBRID ALIGNED BONDING. CURRENTLY MOST SUBMILLIMETER-WAVE ARRAY SYSTEMS UTILIZE A SINGLE PIXEL BOTH FOR SPACE AS WELL AS GROUND APPLICATIONS. WHILE THESE APPROACHES ARE WORKABLE FOR THE NEAR-TERM THEY WILL BECOME UNSUSTAINABLE AS PIXEL COUNT IS INCREASED. IN ADDITION THE SHEAR MASS ASSOCIATED WITH LARGE COUNT HETERODYNE ARRAYS BASED ON SINGLE WAVEGUIDE BLOCK PER CHIP APPROACHES CAN BE A CHALLENGING TASK. IN THIS PROJECT WE PRESENT A 3D WAFER LEVEL INTEGRATION OF THIS TECHNOLOGY USING LOW COST ALIGNED DIRECT WAFER BONDING AT LOW TEMPERATURE OF 2000C. THIS WAFER LEVEL INTEGRATION MAY DECREASE 50-100X IN BOTH VOLUME AND MASS HENCE REDUCES THERMAL GRADIENT. AS OF TODAY MOST OF THE GAIN FLUCTUATIONS IN THIS DEVICE ARE COMING FROM THERMAL GRADIENTS. BY REDUCING THE SIZE AND MASS OF THE RADIOMETER THE THERMAL GRADIENTS THESE DEVICES WILL BE ABLE TO BE USED IN BALLOONS LANDERS OVERS AND ANY OTHER PLACE WHERE A COMPLETE REMOTE CHEMICAL LABORATORY MIGHT BE REQUIRED.$0
· FY2020 · National Aeronautics and Space Administration