← LeaderboardsInvestigatorsiAttributed = a PI's even-split share of each grant — a $1M grant with 2 PIs counts $500K each.
Sinmat, Inc.
Gainesville, FL
$9,138,709
Total funding
18
Grants
Funding over time
peak $2.6M · FY2005–15$5M$3.8M$2.5M$1.3M$0
'05
'06
'07
'08
'09
'10
'11
'12
'13
'14
'15
Funding mix
By agency
DOE$5,246,841 · 5
NSF$3,891,868 · 13
By mechanism
—$9,138,709 · 18
Investigators at Sinmat, Inc.
InvestigatorsiAttributed = a PI's even-split share of each grant — a $1M grant with 2 PIs counts $500K each.
Exposure= the full size of every grant they're on ($1M each).
Rising Stars
First grant in the last 5 yrs
Not enough data
Emerging Leaders
6–10 yrs in
Not enough data
All-Time
Most funded here, all years
Not enough data
Largest grants
TAS::89 0222::TAS NEW PHASE I 2010 STTR; TITLE: LOW COST, SCALABLE MANUFACTURING OF MICROLENS ENGINEERED SUBSTRATES (MLES) FOR ENHANCED LIGHT EXTRA$1,324,943
· FY2010 · Department of Energy
TAS::89 0222::TAS NEW PHASE I 2010 STTR; TITLE: DEFECT FREE, ULTRA-RAPID THINNING/POLISHING OF DIAMOND CRYSTAL RADIATOR TARGETS (20UM) FOR HIGHLY L$1,323,049
· FY2010 · Department of Energy
SBIR-PHASE I NEW; NOVEL POLISHING PROCESS TO FABRICATE ULTRA LOW THICKNESS VARIATION DIAMOND SUBSTRATES FOR NEXT GENERATION BEAM TRACKING DETECTORS;$1,299,507
· FY2012 · Department of Energy
SBIR Phase II: Gentle Atomic Level Chemical Mechanical Smoothening (CMS) of Gallium Nitride Substrates$1,277,900
· FY2007 · TIP
NOVAL RAPID CHEMICAL MECHANICAL POLISHING (CMP) PROCESS FOR FABRICATION OF HIGH PERFORMANCE CVD DIAMOND PARTICLE DETECTORS$1,149,344
· FY2012 · Department of Energy
SBIR Phase II: Single Step Chemical Mechanical Planarization of Copper/Ultra Low k Interconnects$977,173
· FY2006 · TIP
SBIR Phase II: Nanoporous Silica Slurries for Enhanced Chemical Mechanical Planarization (CMP) of Low k Dielectrics$636,889
· FY2004 · TIP
NOVEL ULTRA-HIGH RATE FINISHING PROCESSES FOR PRODUCTION OF 100 MM EPI-READY GAN SUBSTRATES$149,998
· FY2015 · Department of Energy
SBIR Phase I: Novel Slurry for Direct Shallow Trench Isolation (STI) Planarization Process for Sub-50 nm Devices$100,000
· FY2007 · TIP
SBIR Phase I: Sustained Pulmonary Release of Nanoencapuslated Proteins for Counter Bioterrorism Applications$100,000
· FY2006 · TIP
SBIR Phase I: Novel Solid State MicroBatteries Based on Embedded Nanostructured Cathodes of Defective Lithium Manganospinels$100,000
· FY2006 · TIP
SBIR Phase I: Abraisve Free Chemical Mechanical Planarization (AFCMP) Process for Next Generation Copper Interconnects$100,000
· FY2007 · TIP
SBIR Phase I: Novel Hybrid Rapid Thermal Processing (HRTP) Systems for Annealing of Advanced Silicon on Insulator (SOI) Devices$100,000
· FY2006 · TIP
SBIR Phase I: Single Step Chemical Mechanical Planarization of Copper/Ultra Low k Interconnects$99,998
· FY2005 · TIP
SBIR Phase I: Gentle Atomic Level Chemical Mechanical Smoothening (CMS) of GaN and SiC Substrates$99,997
· FY2005 · TIP
SBIR Phase I: Novel Particulate Fluidization Systems for Pulmonary Drug Delivery Applications$99,993
· FY2002 · TIP
SBIR Phase I: High Discharge Rate Rechargeable Lithium Batteries Based on Novel Cathode Materials$99,980
· FY2003 · TIP
SBIR Phase I: Nanoporous Silica Slurry Technology for Enhanced Chemical Mechanical Planarization (CMP) of Low "K" Dielectrics$99,938
· FY2003 · TIP