← Leaderboards
Indranath Dutta
Naval Postgraduate School
$1,996,868
Attributed
$2,376,750
Total exposure
11
Grants
10
Lead (contact PI)
Attributed= this PI's even-split share of every grant they're on (the fair, additive number). Exposure = full size of all those grants.
Funding over time
peak $676K · FY2005–13$1M$750K$500K$250K$0
'05
'06
'07
'08
'09
'10
'11
'12
'13
Funding mix
By agency
NSF$2,376,750 · 11
By mechanism
—$2,376,750 · 11
Top collaborators
- Ravi I Mahajan2 shared
- Bhaskar S Majumdar1 shared
- Knox T Millsaps1 shared
Grant awards (11)
Influence of Electric Field and Stress on Diffusional Sliding at Hetero-Interfaces$396,000
· FY2013 · MPS · contact PI
Collaborative Research: Mechanisms and Processing Strategies for Sn Whisker Mitigation$280,000
· FY2013 · ENG · contact PI
Collaborative Research: Electromagnetic Pulse Cutting of Metallic Components$176,500
· FY2012 · ENG · contact PI
A Breakthrough Nanolithography Technique Using 'Electro-Fountain Pens'$285,000
· FY2011 · ENG · contact PI
EAGER/Collaborative Research: Electromagnetic Pulse Induced Cutting (EPIC) of Metallic Components$56,000
· FY2011 · ENG · contact PI
EAGER: Fracture of Microelectronic Lead Free Solder Joints under Dynamic Loading Conditions$226,625
· FY2009 · MPS · contact PI
NER: Nanostructured Adaptive Solder for Microelectronic Packaging$89,970
· FY2007 · ENG
GOALI: Effects of Processing and Microstructure on the Fracture Properties of Microelectronic Lead Free Solder Joints under Dynamic Loading Conditions$16,897
· FY2007 · MPS · contact PI
Interfacial Creep in Thin Film Interconnect Structures in Micro-Systems$400,665
· FY2005 · MPS · contact PI
GOALI: Creep and Microstructural Coarsening of Lead-Free Solders in Micro-Electronic Packaging Applications$252,232
· FY2002 · MPS · contact PI
Interfacial Creep in Multi-Component Materials Systems$196,861
· FY2000 · MPS · contact PI