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Ranga Komanduri
Oklahoma State University
$888,409
Attributed
$2,281,499
Total exposure
11
Grants
7
Lead (contact PI)
Attributed= this PI's even-split share of every grant they're on (the fair, additive number). Exposure = full size of all those grants.
Funding over time
peak $411.3K · FY2005–11$500K$375K$250K$125K$0
'05
'06
'07
'08
'09
'10
'11
Funding mix
By agency
NSF$2,281,499 · 11
By mechanism
—$2,281,499 · 11
Top collaborators
- Satish Bukkapatnam3 shared
- Hongbing Lu2 shared
- Lionel M Raff2 shared
- Zhen Bing Hou2 shared
- Zhenyu Kong2 shared
- Demirkan Coker1 shared
- Eric A Falk1 shared
- James K Good1 shared
Grant awards (11)
A Recurrent Nested Bayesian Non-parametric Model for Real Time Monitoring of Pattern Dependent Surface Topography in Chemical Mechanical Planarization (CMP) Operations$366,999
· FY2011 · ENG
Workshop on Sensing and Prognostics for Scalability of Nanomanufacturing$5,000
· FY2009 · ENG · contact PI
SGER: Sequential Bayesian Decision Making for End-Point Detection and Control in Chemical Mechanical Planarization (CMP) Processes$80,000
· FY2008 · ENG
Acquisition of an Interfacial Force Microscope (IFM) for Nano-structured Materials, Ultra-precision Manufacturing, and Nanomechanics Research$250,000
· FY2006 · ENG
A Novel Approach for the Development of Accurate ab inito Potential Energy Surfaces for Atomistic Simulations of MEMS Applications$411,316
· FY2005 · ENG · contact PI
Acquisition of a High Speed Digital Camera for Advanced Materials, Processing and Dynamic Events Research$251,725
· FY2003 · ENG
Modeling of the Ultra-Precision Machining Process Using New Combined Molecular Dynamics/Monte Carlo (MD/MC) Simulation$281,000
· FY2002 · ENG · contact PI
WORKSHOP: Unsolved Problems and Research Needs in Thermal Analysis of Material Removal Processes; Stillwater, OK, October 23-25, 2002$33,759
· FY2002 · ENG · contact PI
US-India Cooperative Research: Magnetic Field Assisted Finishing Process$23,700
· FY2002 · O/D · contact PI
Fundamental and Technological Aspects of Finishing Balls of Advanced Ceramics, Glasses, and Silicon Using Magnetic Field Assisted Polishing$316,000
· FY2001 · ENG · contact PI
Modeling of High Speed Machining of Difficult-to-Machine Materials$262,000
· FY2000 · ENG · contact PI