WE PROPOSE TO DEVELOP AND STREAMLINE THE FABRICATION PROCESSES REQUIRED TO PRODUCE BACKGROUND LIMITED LARGE FAR-INFRARED ARRAYS WITH LARGE PIXEL NUMBERS N ~10^5. WE WILL ACHIEVE THIS GOAL BY COMBINING MATURE DETECTOR AND READOUT TECHNOLOGIES FROM OUR PREVIOUS WORK TO FABRICATE A ROBUST CLOSE PACKED HIGH SENSITIVITY BOLOMETER ARRAY WITH RELIABLE HIGH-QUANTUM EFFICIENCY ABSORBERS THAT OPERATES OVER THE ENTIRE FIR RANGE AND CAN BE EFFICIENTLY AND RELIABLY PRODUCED. THE SIMPLIFIED PROCESS WILL INTEGRATE DETECTOR ARRAYS THROUGH SUPERCONDUCTING BONDS TO A COLD READOUT MULTIPLEXER. IT IS VERY VERSATILE IN ITS APPLICATIONS SINCE IT WILL ALLOW THE MATING OF TES DETECTORS TO TIME DOMAIN FREQUENCY DOMAIN MICROWAVE AND CODE DIVISION MULTIPLEXERS. THE MAIN OBJECTIVES WILL BE ACHIEVED BY MEETING THE FOLLOWING GOALS: A) DEVELOP A NOVEL BUG ARCHITECTURE IN WHICH THE SUPERCONDUCTING THROUGH VIA PROCES IS SEPARATED FROM THE DETECTOR PRODUCTION IMPROVING PRODUCTION SPEED AND REDUCING RISK. B) PRODUCTION OF BACKGROUND-LIMITED 5-KILOPIXEL ARRAYS SUITABLE FOR THE FIR SPECTROMETER SUPER-HIRMES. FOR THE LATTER WE WILL ADDITIONALLY: C) REFINE OUR ALMN PROCESS FOR QUICKLY AND RELIABLY FABRICATING TES WITH HIGHLY PREDICTABLE AND UNIFORM TRANSITION TEMPERATURES (BETTER LESS THAN 5% VARIATION) ACROSS THE ENTIRE WAFER D) REFINE A STANDARD PROCESS FOR RELIABLY FABRICATING IMPEDANCE- MATCHED AND ROBUST ABSORBERS FOR THE ENTIRE FIR WAVELENGTH RANGE WHICH ARE NOT SUSCEPTIBLE TO ROOM TEMPERATURE AGING.