NEW COMPETITIVE COOPERATIVE AGREEMENT WITH UNIVERSITY OF MISSOURI: COLUMBIA, DE-FOA-0002851 (COOLERCHIPS) CONTROL NUMBER: 2851-1516 PROJECT TITLE: ''DUAL-MODE HYBRID TWO-PHASE LOOP FOR DATA CENTER COOLING'' THE PROJECT OBJECTIVE IS TO PERFORM A HARDWARE DEMONSTRATION OF A DUAL-MODE HYBRID TWO-PHASE COOLING LOOP TECHNOLOGY FOR DATA CENTER COOLING [I.E., (I) PASSIVE MODE USING A LOOP THERMOSYPHON AND (II) ACTIVE MODE USING A PUMPED TWO-PHASE LOOP]. THE PROPOSED HYBRID TWO-PHASE LOOP (HTPL) IS CAPABLE OF TRANSPORTING LARGE HEAT LOADS (RACK POWER OF > 123 KW, RACK POWER DENSITY OF >146 KW/M3) AT ULTRA-LOW THERMAL RESISTANCES (< 0.01 K/W) WITH NEGLIGIBLE (ZERO FOR PASSIVE MODE, 0.47% OF IT POWER FOR ACTIVE MODE) ENERGY CONSUMPTION.