UNIVERSITY OF ILLINOIS: NEW COOLERCHIPS COOPERATIVE AGREEMENT CONTROL NUMBER: 2851-1600 PROJECT TITLE: HOLISTIC RACK-TO-PROCESSOR POWER AND THERMAL CO-DESIGN FOR FUTURE SERVERS UNIVERSITY OF ILLINOIS PROPOSES TO DEVELOP A TRANSFORMATIVE COOLING TECHNOLOGY BY BRINGING TOGETHER TECHNICAL INNOVATIONS THAT COMBINE TO ENABLE HIGHLY EFFICIENT HEAT TRANSFER FROM DIE LEVEL TO RACK SCALE.