PHOTONIC CURING OF PRINTED COPPER CONTACTS FOR HIGH EFFICIENCY AND LOW COST SILICON HETEROJUNCTIONS THE PRIMARILY OBJECTIVE OF THIS PROJECT IS TO DEVELOP A PRINTABLE COPPER (CU) METALLIZATION PROCESS THAT OUTPERFORMS CONVENTIONAL SILVER (AG) PASTES, DOES NOT REQUIRE ANY PLATING OR THERMAL ANNEALING IN AN INERT ATMOSPHERE, AND DOES NOT EXHIBIT HIGHER PERFORMANCE DEGRADATION THAN AG-BASED METALLIZATION. THE TEAM AIMS TO ACHIEVE SILICON HETEROJUNCTION (SHJ) PHOTOVOLTAIC (PV) CELL EFFICIENCIES OF AT LEAST 22.0%, CU BULK RESISTIVITY (¿B) VALUES LESS THAN 5 ΜO·CM, CU/INDIUM TIN OXIDE (ITO) CONTACT RESISTIVITY (¿C) VALUES LESS THAN 10 MO·CM2, AND CU LINE WIDTHS LESS THAN 40 ΜM. THE TEAM ALSO AIMS TO DISSEMINATE FINDINGS TO THE PV R&D COMMUNITY AND INDUSTRY THROUGH MULTIPLE PEER-REVIEWED JOURNAL ARTICLES AND PERIODIC PRESENTATIONS AT NOTABLE PV CONFERENCES.

The University Of Central Florida Board Of Trustees, Orlando FL

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