METAL COMPLEX INKS FOR LOW-COST PHOTOVOLTAIC MATERIAL METALLIZATION THIS PROJECT WILL DEVELOP NEW SCREEN-PRINTED REACTIVE METAL COMPLEX PASTES, INVENTED AND COMMERCIALIZED BY ELECTRONINKS, INC. (EI, AUSTIN, TX USA, HTTPS://ELECTRONINKS.COM), FOR PHOTOVOLTAIC APPLICATIONS TO SIGNIFICANTLY LOWER THE COST OF METALLIZATION AND IMPROVE DEVICE EFFICIENCIES. THE NEW PASTES WILL DO SO BY: 1) LOWERING THE FINGER RESISTIVITY AND PRECIOUS METALS USAGE BY PRINTING MUCH DENSER (AND THEREFORE THINNER/LESS MATERIAL) METAL FILMS THAN POSSIBLE WITH TRADITIONAL PARTICLE-BASED SCREEN-PRINTED PASTES; 2) DECREASING THE FIRING TEMPERATURE TO HELP PRESERVE PASSIVATION; AND 3) ENABLING A PATH TO MOVE THE TW-SCALE PV INDUSTRY FROM AG TO OTHER MATERIALS INCLUDING NI, CU, AND NI/CU ALLOY PASTES WHILE CONTINUING TO LEVERAGE CAPITAL INVESTMENT AND EXPERTISE IN SCREEN PRINTING METALLIZATION. THE OBJECTIVE FOR BUDGET PERIOD ONE IS TO DEVELOP A CU-BASED, METAL-COMPLEX INK WITH A MINIMUM RESISTIVITY APPROPRIATE FOR PV APPLICATIONS. THE OBJECTIVE FOR BUDGET PERIOD TWO IS TO TEST THE CU-BASED, METAL-COMPLEX INKS ON TUNNEL OXIDE PASSIVATED CONTACT (TOPCON) AND SILICON HETEROJUNCTION (SHJ OR HJT) SOLAR CELL SURFACES FOR CONTACT RESISTIVITY AND RELIABILITY.