THE PURPOSE OF THIS AGREEMENT IS TO FUND RESEARCH SUPPORTING THE DEFENSE ADVANCED RESEARCH PROJECTS AGENCYS DARPA OPTOMECHANICAL THERMAL IMAGING OPTIM PROGRAM. THIS EFFORT SHALL BE CARRIED OUT GENERALLY AS SET FORTH IN EXHIBIT B, RESEARCH DESCRIPTION DOCUMENT, DATED JUNE 23, 2023 AND IN THE RECIPIENTS, PROPOSAL TITLED, ENGINEERING 80 FW HZ1 2 THERMAL IMAGING IN CHIP SCALE CAVITY OPTOMECHANICS, DATED NOVEMBER 1, 2022, COPIES OF WHICH ARE IN THE POSSESSION OF BOTH PARTIES.