THE PURPOSE OF THIS AGREEMENT IS TO FUND RESEARCH SUPPORTING THE DEFENSE ADVANCED RESEARCH PROJECTS AGENCY DARPA ULTRA WIDE BANDGAP SEMICONDUCTORS UWBGS PROGRAM. THIS EFFORT SHALL BE CARRIED OUT GENERALLY AS SET FORTH IN EXHIBIT B, RESEARCH DESCRIPTION DOCUMENT, DATED JULY 8, 2024 AND IN THE RECIPIENTS PROPOSAL TITLED, DEVELOPMENT AND SCALING OF CUBIC BORON NITRIDE SUBSTRATES, DATED DECEMBER 14, 2023, COPIES OF WHICH ARE IN THE POSSESSION OF BOTH PARTIES.