THE RESEARCH AIMS TO SUPPORT THE ADVANCEMENT OF HYBRID 3D ADDITIVE MANUFACTURING (AM) SCIENCE BY COMBINING MULTISCALE PROCESSING OF HIGHLY CONDUCTIVE AND HIGH DIELECTRIC CONSTANT PRINTABLE INK MATERIALS WITH HYBRID INTERFACIAL ADHESION AND NON-DESTRUCTIVE EVALUATION OF PRINTED ELECTRONICS FOR EXTREME DYNAMIC ENVIRONMENTS.
$300,000FY2025Department of the ArmyDOD
University Of Maryland, College Park, College Park MD