SBIR Phase I: Lead-Free Sintering Adhesives for Electronics Thermal Management

Creative Electron, Inc., San Marcos CA

Investigators

Abstract

This Small Business Innovation Research Phase I project will develop and characterize lead-free adhesives with very high thermal and electrical conductivity for wide bandgap semiconductor packaging. The company will build on its IP portfolio of fluxing adhesive binder systems to formulate polymer fluxes suitable for low-temperature, lead-free solders. The development of cost effective, high performance packaging systems will hasten the adoption of wide bandgap semiconductor components for high power electronic and optoelectronic applications. This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).