GGrantIndex
← Search

3D HETEROGENEOUS INTEGRATION OF MICROWAVE/MILLIMETER-WAVE SENSOR AND COMMUNICATIONS MICROSYSTEMS USING HIGH-ASPECT RATIO MICROMACHINED "BUILDING BLOC

$412,289FY2008Department of the ArmyDOD

Virginia Polytechnic Institute & State University

Investigators

View source on USAspending →
3D HETEROGENEOUS INTEGRATION OF MICROWAVE/MILLIMETER-WAVE SENSOR AND COMMUNICATIONS MICROSYSTEMS USING HIGH-ASPECT RATIO MICROMACHINED "BUILDING BLOC · GrantIndex