Micro Laser Assisted Machining of Semiconductors and Ceramics

Western Michigan University, Kalamazoo MI

Investigators

Abstract

The research objective of this award is to determine the physical benefit of using lasers at the micro scale to improve the machining process of brittle semiconductors and ceramic materials through measurements of cutting forces and tool wear, complemented with numerical simulations for comparison. The approach will be to design and build the micro laser assisted machining tools and system and to evaluate their performance in actual cutting tests on materials such as silicon and silicon carbide. Process parameters including forces and wear measurements will be used to evaluate the effectiveness of the laser system and optimize its performance as a tool for improving the manufacturing process. If successful this research will lead to a new cost effective process capability for producing advanced components from difficult to machine materials that will result in reduced component cost for semiconductors and engineered ceramics and provide an opportunity for extending the use of these materials to new products and markets. Reduced cost manufacturing and extended use of high performance semiconductors and engineered ceramics are vitally important in the advanced transportation market, especially for the development of the next generation of fuel efficient gas, hybrid and electric vehicles.