CSR---SMA: Thermal Modeling, Management, and Characterization of Chip Multiprocessors

Princeton University, Princeton NJ

Investigators

Abstract

Ever-increasing power densities and cooling costs have led to the consideration of the power and thermal impact of chip multiprocessor (CMP) designs during early design stages. The aim of this project is to perform thermal modeling and simulation of CMPs, develop dynamic thermal management (DTM) techniques and perform thermal characterization of such designs. Thermal models being developed can accurately capture the thermal characteristics of the processors, on-chip network and packaging. The DTM techniques target the processors and network synergistically. A large suite of applications are being thermally characterized on both fine-grain and coarse-grain CMPs. Broader impacts will include making the tools available on the web to help other researchers, inclusion of material in a graduate-level course, involvement of undergraduates in research and outreach to female and minority students.