RUI: MRI Acquisition of a Scanning Electron Microscope with Energy Dispersive X-Ray and C-Mode Scanning Acoustic Microscope for a Centralized Laboratory for Imaging and Metrology

Rochester Institute Of Tech, Rochester NY

Investigators

Abstract

This major research instrumentation (MRI) grant is submitted within the framework of the Research in Undergraduate Institutions (RUI) program. The mission of this RUI submission is the establishment of a Centralized Laboratory of Imaging and Metrology (CLIM) at the Rochester Institute of Technology. The instrumentation requested includes a scanning electron microscope (SEM) with energy dispersive X-ray (EDX) capability and a C-Mode Scanning Acoustic Microscope that would greatly enhance RIT's ability to conduct competitive undergraduate research. Intellectual Merit: CLIM will build upon RIT's existing strengths in Semiconductor and Microsystems fabrication and packaging to bridge the applied research gap between basic research and product commercialization. The impact of the proposed research instrumentation will be in the establishment of a strong research base for investigators and undergraduates. A major component of the investigators vision involves establishing the undergraduate research infrastructure required to (i) publish in refereed journals by undergraduates, (ii) enhance RIT's credibility to funding agencies to secure funding for undergraduate research, and (iii) provide a superior environment for undergraduate education. Various examples of research activity enabled by this equipment listed in the Project Description section of this proposal include: photonic lightwave integrated circuits fabrication, wafer bonding, microfluidic package analysis, packaging yield analysis, and Silicon on Insulator substrate characterization. These diverse efforts share a common need to characterize (i) material properties, (ii) process development, and (iii) failure mechanisms. Nondestructive structural, and chemical analysis and nanometer-scale imaging capability is fundamental to the success of the proposed research initiatives. The scanning electron microscope, energy dispersive X-ray, and a C-Mode Scanning Acoustic Microscope enable imaging, chemical analysis, and structural analysis, respectively. Broader Impact: In the first year of this program alone, it is estimated that through projects, classroom instruction, and research, 150 students will benefit from this instrumentation. This equipment will be introduced immediately, as a centerpiece to several classes, which include the following: EMCR 201 (Introduction to Microelectronic Engineering), EMCR 221 (Introduction to Microlithography), EMCR 350 (IC Technology), EMCR 564 (Microlithography Systems), EMCR 643 (Thin Film Processing), EMCR 650 (IC Processing Laboratory), EMCR 680/690 (Senior Seminar Research), ITFF 455 (Introduction to Surface Mount Electronics Packaging), ITFF 456 (Advanced Concepts in Electronics Packaging), and ITFF 457 (Electronics Packaging Laboratory). The research will be conducted by three faculty from RIT (S. L. Rommel-Microelectronic Engineering, A.D. Raisanen-Semiconductor Microsystems Fabrication Laboratory, and S.M. Ramkumar- Manufacturing Mechanical Engineering Technology and Packaging Science) in the area of materials, process and failure characterization of microsystems development and packaging. This project will foster collaboration between device and packaging researchers at RIT to realize next-generation, high-performance microsystems.