Soft-Pad Grinding of Wire-Sawn Silicon Wafers

Kansas State University, Manhattan KS

Investigators

Abstract

This grant provides funding for research aiming to advance the understanding and knowledge of wire-sawn wafer grinding on soft pads and to promote the widespread application of the technology. Finite element simulation will be carried out to develop a fundamental understanding of the soft-pad grinding and its effectiveness in removing the wire-sawing induced waviness, and to generate knowledge of the effects of pad materials and process parameters on waviness removal. Experiments will be performed to validate the finite element model. The understanding and knowledge acquired will provide guidance to overcome the technical barriers that have hindered the widespread application of soft-pad grinding. Success of this project will substantially enhance U.S. companies' competitiveness. Soft-pad grinding is more benign to the environment and more cost-effective than lapping. Achieving the project's goal will benefit not only the U.S. silicon wafer industry and semiconductor industry, but also society at large. Investigators with complementary experience and research skills are joining forces to conduct this research. Unique facilities at Kansas State University, University of South Florida, MEMC, Norton and Strasbaugh are integrated. Such collaboration provides excellent synergy for project resources, ensures the relevance of research to industry, and expedites technology transfer and commercialization. It also provides excellent opportunities for faculty and students to interact with industry, and will have highly positive impact to engineering education.