2001 TSE: NSF/EPA Partnership for Environmental Research: Design for product-embedded disassembly using reversible integral attachments (TSE01-H)

Regents Of The University Of Michigan - Ann Arbor, Ann Arbor MI

Investigators

Abstract

0124415 Saitou The goal of the proposed research is to develop a general method for designing products with embedded disassembly processes that can be invoked by "pressing a disassembly button". This will be achieved by developing a new class of reversible integral attachments (RIAs) that can be detached by the application of localized heat. Design methodologies will be developed that will facilitate: (1) the identification of the components to be recovered, and (2) the embedding of RIAs into the product to facilitate the most efficient access to the components of interest upon product disassembly. Specific research tasks include: (1) extension of existing approaches toward determining recovery targets to include environmental validation metrics with the intent of considering both environmental and financial factors during design for disassembly, (2) development of a design method for a new class of RIAs that can be detached by application of localized heat, based on the structural topology optimization algorithm, and (3) development of a systematic procedure to generate the design specifications (attachment location, engagement type, removal direction, heating spot location) for RIAs using computer aided design technology in order to realize the most efficient access to components, based on the overall product geometry and the desired disassembly sequence. ***