RUI: Modeling Formation of Microstructure of Intermetallic Compounds During Soldering.

$37,306FY2001MPSNSF

Northern Arizona University, Flagstaff AZ

Investigators

Alexander R Umantsevcontact

View original record on NSF Award Search →

RUI: Modeling Formation of Microstructure of Intermetallic Compounds During Soldering. · GrantIndex