A Novel Ultrasonic Cooling Concept for Microelectrics

North Carolina State University, Raleigh NC

Investigators

Abstract

The purpose of the proposed work is to design a novel cooling device for microelectronic systems using ultrasonic flexural waves (UFW's) of a resonating structure. The ultrasonic nature affords two essential features of such a device: Efficient cooling that derives from a high rate of acoustic streaming of air that causes convective heat transfer away from a heat source near the resonating structure and noise-free operation which is recognized as an important consumer benefit. To achieve this, three objectives are sought. First, the design of a chip-size cooling mechanism and on-chip assembly that will ensure optimum cooling capability will be investigated. Second, a heat transfer analysis of UFW-based acoustic streaming will be carried out with a goal of accurately predicting the cooling performance of such a device. Thirdly, based on the heat transfer analysis, a prototype design will be undertaken utilizing thin-film MEMS technology for power efficiency and economic viability. Final testing and evaluation will be carried out using specifications and procedures typically employed for computer processors.