A Coupled Lattice-based Continuum Formulation for Stress and Electromigration-mediated Diffusion in Polycrystalline Solids

Regents Of The University Of Michigan - Ann Arbor, Ann Arbor MI

Investigators

Abstract

0075989 The research aims at developing a continuum formulation reflecting the coupling between composition and mechanics in polycrystalline solids. Electromigration effects are also included. The motivation is to model the evolution of microstructure, which can lead to failure of metal lines in integrated circuits. Composition, mechanics and electric fields interact via lattice-level mechanisms in a thermodynamic formulation from which the coupled field relations are derived. General initial and boundary value problems reflecting the complexity of phenomena such as diffusion creep, hillock formation, grain boundary motion, void formation and evolution can then be posed. The project will also develop computational methodologies to solve the resulting system of coupled partial differential equations.