GOALI: Mechanical Reliability of Surface Mount Electronic Packages

Tulane University, New Orleans LA

Investigators

Abstract

A GAOLI Faculty-in-Residency award supports a six month visit by the PI and the TRW facilities in Claifornia and follow-up work by a graduate student at both the home institution and the industrial site. The topic of sutdy is development of design guides for surface mount electronic packages based on fracture cracks in mode II loading combined with mode I closing closing forces. The project will combine the PI's computational modeling skills and the experimental and fabrication capabilities and experience of the industrial partner. Initially, a model for life cycle and calculation for interconnect solder arrays, based on a power law-governed energy release per cycle and on residual stress assumptions for the eutectic solder, will be validated by experiments. It will later be expanded to other architectures.